Papua New Guinea Thermal Conductivity Tester, Heat Flow Method
Product Description
Xiangke DRL-III Thermal Conductivity Tester, Heat Flow Method Thermal Conductivity Meter, Thermal Analysis Instrument, Thermal Resistance Tester
I. Overview
This instrument is mainly used to test the thermal resistance of thin thermal conductors, solid electrical insulating materials, thermally conductive resins, silicone rubber and grease, rubber, plastics, beryllium oxide ceramics, alumina ceramics and other small materials, as well as the contact thermal resistance at the solid interface and the thermal conductivity of the materials. The test material is in the form of solid flakes. With a frame, it can also test powder and paste materials.
Instrument reference standards: MIL-I-49456A (insulating sheets, thermally conductive resins, thermally conductive fiberglass reinforced); GB 5598-85 (determination method of thermal conductivity of beryllium oxide ceramics); ASTM-D5470-12 (test standard for heat transfer performance of thin thermally conductive solid electrical insulating materials), etc.
Instrument features: automatic pressurization, automatic thickness measurement, fully automatic experimental control. 6-point temperature gradient detection to improve testing accuracy. It can detect the thermal resistance curve under different pressures, uses an optimized mathematical model to measure the thermal conductivity and thermal resistance of materials, and the contact thermal resistance at the interface.
Widely used in colleges and universities, scientific research units, quality inspection departments and manufacturing plants for material analysis and testing.
II. Xiangke DRL-III Thermal Conductivity Tester, Heat Flow Method Main Parameters
Main Parameters | DRL-3 (Standard Type) | DRL-3 (Enhanced Type) | DRL-3P (Vacuum Type) |
1. Sample Size | ≤Φ30mm | ≤Φ30mm | ≤Φ30mm |
2. Sample Thickness | 0.02-20mm | 0.02-20mm | 0.02-20mm |
3. Hot-end Temperature | Room temperature - 99.99℃ | Room temperature - 200℃ | Room temperature - 100℃ |
4. Cold-end Temperature | 0-99.0℃ | 0-99.0℃ | 0-99.0℃ |
5. Thermal Conductivity | 0.1～45 W/m*k | 0.05～45 W/m*k | 0.05～45 W/m*k |
6. Thermal Resistance (m2*K/W) | 0.000005～0.05 | 0.000005～0.05 | 0.000005～0.05 |
7. Testing Accuracy | ≤3% | ≤3% | ≤3% |
7. Pressure Measurement | 0～1000N | 0～1000N | 0～1000N |
8. Displacement Measurement | 0～40mm | 0～40mm | 0～40mm |
9. Pressure Control | Electric | Electric | Electric |
10. Testing Environment | Air | Air | Vacuum |
10. Experimental Methods | a. Thermal resistance test of samples under different pressures. b. Thermal conductivity test of materials. c. Contact thermal resistance test. d. Thermal resistance test of aluminum substrates (composite materials). e. Aging reliability test. | ||
11. Power Supply | Voltage: 220V, Power less than 1KW. | ||
Instrument Selection: The DRL-3 (Enhanced Type) is based on the DRL-3 (Standard Type) with improved hot-end temperature, mainly used for testing materials with slightly higher temperature requirements and slightly lower thermal conductivity; DRL-3P is mainly used for testing materials that are easily oxidized and require a vacuum testing environment.
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