Papua New Guinea Thermal Conductivity Tester
Product Description
Xiangtan Xiangke DRL-III Series Thermal Conductivity Tester (Heat Flow Method)
I. Overview
This instrument is mainly used to test the thermal resistance of thin thermal conductors, solid electrical insulating materials, thermally conductive resins, silicone rubber and grease, rubber, plastics, beryllium oxide ceramics, alumina ceramics, aluminum-clad copper clad plates and other small materials, as well as the contact thermal resistance at the solid interface and the thermal conductivity of the materials. The test material is in the form of solid flakes. With a frame, powder and paste materials can also be tested.
Instrument reference standards: MIL-I-49456A (insulating sheets, thermally conductive resins, thermally conductive glass fiber reinforced); GB 5598-2015 (Determination method of thermal conductivity of beryllium oxide ceramics - rod axis method); ASTM D5470-12 (Test standard for thermal performance of thin thermally conductive solid electrical insulating materials), GB/T38712-2020 (Experimental method for thermal conductivity of ultra-thin glass - heat flow method), GB/T29313-2012 Test method for thermal conductivity of electrical insulating materials, etc.
Instrument features: Automatic pressurization, automatic thickness measurement, fully automatic experimental control. 6-point temperature gradient detection to improve testing accuracy. It can detect the thermal resistance curve under different pressures, uses an optimized mathematical model to measure the thermal conductivity and thermal resistance of materials, and the contact thermal resistance at the interface.
Widely used in colleges and universities, scientific research units, quality inspection departments and manufacturing plants for material analysis and testing.
II. DRL-III Series Thermal Conductivity Tester Main Parameters
Main Parameters | DRL-3 (Standard Type) | DRL-3 (Enhanced Type) | ||
1. Sample Size | ≤Φ30mm | ≤Φ30mm | ||
2. Sample Thickness | 0.02-20mm | 0.02-20mm | ||
3. Hot Spot Temperature | Room temperature - 99.99℃ | Room temperature - 200℃ | ||
4. Cold Spot Temperature | 0-99.0℃ | 0-99.0℃ | ||
5. Thermal Conductivity | 0.1～45 W/m*k | 0.05～45 W/m*k | ||
6. Thermal Resistance (m2*K/W) | 0.000005～0.05 | 0.000005～0.05 | ||
7. Testing Accuracy | ≤3％ | ≤3％ | ||
7. Pressure Measurement | 0～1000N | 0～1000N | ||
8. Displacement Measurement | 0～40mm | 0～40mm | ||
9. Pressure Control | Electric | Electric | ||
10. Experimental Methods | a. Thermal resistance test of samples under different pressures. b. Thermal conductivity test of materials. c. Contact thermal resistance test. d. Thermal resistance test of aluminum substrate (composite materials). e. Aging reliability test. |
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11. Power Supply | Voltage: 220V, power less than 1KW. | |||
Instrument selection: DRL-3 (Enhanced type) is based on DRL-3 (Standard type) to improve the hot spot temperature, mainly used for testing materials with slightly higher temperature requirements and slightly lower thermal conductivity; DRL-3A is mainly used for testing materials with slightly higher temperature requirements; DRL-3B is mainly used for measuring thermal insulation materials.
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