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The transient thermal analyzer mainly tests the thermal resistance of thin thermal conductors, solid electrical insulating materials, thermal grease, resins, rubbers, beryllium oxide ceramics, aluminum oxide ceramics, etc., as well as the contact thermal resistance at the solid interface and the thermal conductivity of the materials. With the addition of a high thermal conductivity detection device, it can also test the thermal conductivity of high thermal conductivity materials such as aluminum alloys, and the contact thermal resistance between metals, and between metals and thermal pads.
The Xiangke DRE-5C Transient Plane Heat Source Method Thermal Conductivity Tester, a newly upgraded model, is a comprehensive upgrade of the DRE-2C model. It uses the transient plane heat source method, and the upgraded product has more powerful functions.
The Xiangke DRPL-3B thermal conductivity tester (guarded hot plate method) features a large measurement range, wide testing scope, and small sample size, making it suitable for a broad range of applications. Based on the steady-state plate method, the instrument applies a stable temperature to the hot surface. Heat is transferred through the sample to the cold surface, and the heat flow is measured. The thermal conductivity and thermal resistance can then be calculated based on the sample thickness and heat transfer area. This testing method is simple, fast, and highly repeatable. It is ideal for research and development in material heat transfer. It can be used to test nylon, plastics, silicone rubber, graphite, insulation materials, etc.
The Xiangke DRL-V hot flow method multifunctional thermal conductivity tester mainly tests the thermal resistance of thin thermal conductors, solid electrical insulating materials, thermal grease, resins, rubbers, beryllium oxide ceramics, and aluminum oxide ceramics, as well as the contact thermal resistance at the solid interface and the thermal conductivity of the materials. With the addition of a high thermal conductivity detection device, it can also test the thermal conductivity of high thermal conductivity materials such as aluminum alloys and the contact thermal resistance between metals and between metals and thermal pads.
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