Transient Thermal Analyzer
零售价
$ 1
市场价
$ 1
重量
库存剩余
400
隐藏域元素占位
- 产品描述
-
- Commodity name: Transient Thermal Analyzer
- Model: DRE-2C
- 规格: A1<BR> A2<BR> A3<BR> A4
The transient thermal analyzer mainly tests the thermal resistance of thin thermal conductors, solid electrical insulating materials, thermal grease, resins, rubbers, beryllium oxide ceramics, aluminum oxide ceramics, etc., as well as the contact thermal resistance at the solid interface and the thermal conductivity of the materials. With the addition of a high thermal conductivity detection device, it can also test the thermal conductivity of high thermal conductivity materials such as aluminum alloys, and the contact thermal resistance between metals, and between metals and thermal pads.
Xiangke DRE-2C Thermal Conductivity Tester (Transient Plane Heat Source Method)
I. Transient Thermal Conductivity Meter Main Features
1. Fast and accurate: Testing can be completed in 5-160 seconds
2. Non-destructive testing: The sample is not damaged and can be reused
3. Simple sample preparation: No special requirements for sample size
4. Wide range of test objects: Can test block solids, granular solids, liquids, powders, colloids, and pastes
5. High flexibility: Independent sample holder, detachable probe, flexible testing
6. User-friendly interface, easy to operate: Computer-controlled and displayed, convenient and easy to understand
II. Transient Thermal Conductivity Meter Characteristics：
1. Instrument reference standard: ISO 22007-2 2008;
2. Wide testing range, stable testing performance, leading among similar instruments in China;
3. Direct measurement, testing time around 5-160s can be set, can quickly and accurately measure the thermal conductivity, saving a lot of time;
4. Unlike the static method, it is not affected by contact thermal resistance;
5. No special sample preparation is required, and there are no special requirements for the sample shape. For block solids, only a relatively smooth sample surface is required, and the length and width must be at least twice the diameter of the probe;
6. Non-destructive testing of samples means that samples can be reused;
7. The probe adopts a double-helix structure design, combined with a proprietary mathematical model, using core algorithms to analyze and calculate the data collected on the probe;
8. The sample stage is cleverly designed, easy to operate, suitable for placing samples of different thicknesses, and simple and beautiful;
9. The data acquisition on the probe uses imported data acquisition chips. The high resolution of this chip makes the test results more accurate and reliable;
10. The host control system uses an ARM microprocessor, which is faster than traditional microprocessors, improving the system's analysis and processing capabilities, and making the calculation results more accurate;
11. The instrument can be used for the determination of thermal physical parameters of block solids, paste-like solids, granular solids, colloids, liquids, powders, coatings, films, and insulation materials;
12. Intelligent human-machine interface, color LCD display, touch screen control, convenient and simple operation;
13. Powerful data processing capabilities. Highly automated computer data communication and report processing system.
III. Test Objects:
Metals, ceramics, alloys, ores, polymers, composites, paper, textiles, foam plastics (flat insulation materials, plates), mineral wool, cement walls, glass fiber reinforced composite panels CRC, cement polystyrene boards, sandwich concrete, fiberglass panel composite materials, paper honeycomb panels, colloids, liquids, powders, granular and paste-like solids, etc., with a wide range of test objects.
IV. Technical Parameters:
1. Thermal conductivity measurement range: 0.0010-300 W/mk, resolution: 0.0001 W/(m·K);
2. Measurement time: 1-600 seconds;
3. Measurement relative error: ≤3%; Repeatability error: ≤ 3%;
4. Temperature range: Standard measurement: room temperature, various temperature ranges can be selected according to customer requirements, such as room temperature~150℃ with optional constant temperature test chamber, -40℃~100℃ with optional high and low temperature test chamber, etc., the cost will be calculated separately;
5. Sample size:
Solid block samples: Sample size not less than 30*30*7.5mm; Multiple layers can be stacked for detection if a single layer is not enough, with a relatively flat sample surface; Powder and colloid materials can be detected by directly inserting the probe;
6. Instrument reference standard: ISO 22007-2008 and GB/T32064-2015 Transient plane heat source test method for thermal conductivity and thermal diffusivity of building materials;
7. Easy to operate, fast testing speed, only need to clamp the test probe between two sample blocks, and the thermal conductivity of the sample can be obtained through simple software click operation;
8. Power supply: Voltage 220V; Frequency 50Hz; Power <500W;
9. Communication interface: USB interface.
V. Probe Technical Indicators:
1. Heating material: Nickel metal;
2. Operating temperature: -50~150℃;
3. Maximum power: 20w;
4. Maximum voltage: 20V;
5. Maximum current: 1A;
6. Resistance: Around 10Ω, subject to the resistance marked on the probe;
7. Nickel wire specifications: Thickness 0.01mm, hot wire width: 0.35±0.03mm; Hot wire spacing: 0.35±0.03mm;
8. Protective layer material: Polyimide film (Kapton); Single layer thickness: 0.06mm;
9. Probe diameter: 7.5mm or 15mm, two specifications are optional;
10. Total probe thickness (including adhesive layer thickness) 0.07±0.02mm.
Two appearance styles are optional:
Transient Thermal Analyzer
Model:
DRE-2C
Specifications:
Specifications:
这里是占位文字
Gross weight (KG):
The transient thermal analyzer mainly tests the thermal resistance of thin thermal conductors, solid electrical insulating materials, thermal grease, resins, rubbers, beryllium oxide ceramics, aluminum oxide ceramics, etc., as well as the contact thermal resistance at the solid interface and the thermal conductivity of the materials. With the addition of a high thermal conductivity detection device, it can also test the thermal conductivity of high thermal conductivity materials such as aluminum alloys, and the contact thermal resistance between metals, and between metals and thermal pads.
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You can send us an email：xtyqyb@163.com
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Xiangke DRE-2C Thermal Conductivity Tester (Transient Plane Heat Source Method)
I. Transient Thermal Conductivity Meter Main Features
1. Fast and accurate: Testing can be completed in 5-160 seconds
2. Non-destructive testing: The sample is not damaged and can be reused
3. Simple sample preparation: No special requirements for sample size
4. Wide range of test objects: Can test block solids, granular solids, liquids, powders, colloids, and pastes
5. High flexibility: Independent sample holder, detachable probe, flexible testing
6. User-friendly interface, easy to operate: Computer-controlled and displayed, convenient and easy to understand
II. Transient Thermal Conductivity Meter Characteristics：
1. Instrument reference standard: ISO 22007-2 2008;
2. Wide testing range, stable testing performance, leading among similar instruments in China;
3. Direct measurement, testing time around 5-160s can be set, can quickly and accurately measure the thermal conductivity, saving a lot of time;
4. Unlike the static method, it is not affected by contact thermal resistance;
5. No special sample preparation is required, and there are no special requirements for the sample shape. For block solids, only a relatively smooth sample surface is required, and the length and width must be at least twice the diameter of the probe;
6. Non-destructive testing of samples means that samples can be reused;
7. The probe adopts a double-helix structure design, combined with a proprietary mathematical model, using core algorithms to analyze and calculate the data collected on the probe;
8. The sample stage is cleverly designed, easy to operate, suitable for placing samples of different thicknesses, and simple and beautiful;
9. The data acquisition on the probe uses imported data acquisition chips. The high resolution of this chip makes the test results more accurate and reliable;
10. The host control system uses an ARM microprocessor, which is faster than traditional microprocessors, improving the system's analysis and processing capabilities, and making the calculation results more accurate;
11. The instrument can be used for the determination of thermal physical parameters of block solids, paste-like solids, granular solids, colloids, liquids, powders, coatings, films, and insulation materials;
12. Intelligent human-machine interface, color LCD display, touch screen control, convenient and simple operation;
13. Powerful data processing capabilities. Highly automated computer data communication and report processing system.
III. Test Objects:
Metals, ceramics, alloys, ores, polymers, composites, paper, textiles, foam plastics (flat insulation materials, plates), mineral wool, cement walls, glass fiber reinforced composite panels CRC, cement polystyrene boards, sandwich concrete, fiberglass panel composite materials, paper honeycomb panels, colloids, liquids, powders, granular and paste-like solids, etc., with a wide range of test objects.
IV. Technical Parameters:
1. Thermal conductivity measurement range: 0.0010-300 W/mk, resolution: 0.0001 W/(m·K);
2. Measurement time: 1-600 seconds;
3. Measurement relative error: ≤3%; Repeatability error: ≤ 3%;
4. Temperature range: Standard measurement: room temperature, various temperature ranges can be selected according to customer requirements, such as room temperature~150℃ with optional constant temperature test chamber, -40℃~100℃ with optional high and low temperature test chamber, etc., the cost will be calculated separately;
5. Sample size:
Solid block samples: Sample size not less than 30*30*7.5mm; Multiple layers can be stacked for detection if a single layer is not enough, with a relatively flat sample surface; Powder and colloid materials can be detected by directly inserting the probe;
6. Instrument reference standard: ISO 22007-2008 and GB/T32064-2015 Transient plane heat source test method for thermal conductivity and thermal diffusivity of building materials;
7. Easy to operate, fast testing speed, only need to clamp the test probe between two sample blocks, and the thermal conductivity of the sample can be obtained through simple software click operation;
8. Power supply: Voltage 220V; Frequency 50Hz; Power <500W;
9. Communication interface: USB interface.
V. Probe Technical Indicators:
1. Heating material: Nickel metal;
2. Operating temperature: -50~150℃;
3. Maximum power: 20w;
4. Maximum voltage: 20V;
5. Maximum current: 1A;
6. Resistance: Around 10Ω, subject to the resistance marked on the probe;
7. Nickel wire specifications: Thickness 0.01mm, hot wire width: 0.35±0.03mm; Hot wire spacing: 0.35±0.03mm;
8. Protective layer material: Polyimide film (Kapton); Single layer thickness: 0.06mm;
9. Probe diameter: 7.5mm or 15mm, two specifications are optional;
10. Total probe thickness (including adhesive layer thickness) 0.07±0.02mm.
Two appearance styles are optional:
Relevant Specifications
Relevant Specifications
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